- 密度 [g/cm3]: 1.57
- 彎曲模量 [MPa]: 10.5
| Physical Properties | Metric | English | Comments | ||
|---|---|---|---|---|---|
| Density | 1.57 g/cc | 0.0567 lb/in3 | ISO 1183 | ||
| Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in3 | ISO 60 | ||
| Linear Mold Shrinkage, Flow | 0.0019 cm/cm | 0.0019 in/in | Compression molding; ISO 2577 | ||
| 0.0045 cm/cm | 0.0045 in/in | Injection molding; ISO 2577 | |||
| Mechanical Properties | Metric | English | Comments | ||
| Ball Indentation Hardness | 400 MPa | 58000 psi | H 961/30; ISO 2039/P1 | ||
| Tensile Strength at Break | 65.0 MPa | 9430 psi | 5 mm/min; ISO 527 - 1/2 | ||
| Tensile Modulus | 10.5 GPa | 1520 ksi | 1 mm/min; ISO 527 - 1/2 | ||
| Flexural Strength | 125 MPa | 18100 psi | 2 mm/min; ISO 178 | ||
| Flexural Modulus | 10.5 GPa | 1520 ksi | ISO 178 | ||
| Compressive Strength | 230 MPa | 33400 psi | Test specimen flat tested; ISO 604 | ||
| Charpy Impact Unnotched | 0.900 J/cm2 @Temperature 23.0 °C | 4.28 ft-lb/in2 @Temperature 73.4 °F | ISO 179-1/2 eU | ||
| Charpy Impact, Notched | 0.200 J/cm2 @Temperature 23.0 °C | 0.952 ft-lb/in2 @Temperature 73.4 °F | ISO 179-1/2 eA | ||
| Electrical Properties | Metric | English | Comments | ||
| Volume Resistivity | 1.00e+12 ohm-cm | 1.00e+12 ohm-cm | IEC 60093 | ||
| Surface Resistance | 1.00e+11 ohm | 1.00e+11 ohm | IEC 60093 | ||
| Dielectric Constant | 8.0 @Frequency 100 Hz | 8.0 @Frequency 100 Hz | IEC 60250 | ||
| Dielectric Strength | 30.0 kV/mm @Thickness 1.00 mm | 762 kV/in @Thickness 0.0394 in | IEC 60243-P1 | ||
| Dissipation Factor | 0.20 @Frequency 100 Hz | 0.20 @Frequency 100 Hz | IEC 60250 | ||
| Arc Resistance | 130 - 135 sec | 130 - 135 sec | ASTM D495 | ||
| Comparative Tracking Index | 175 V | 175 V | Test liquid A; IEC 60112 | ||
| Hot Wire Ignition, HWI | >= 120 sec @Thickness 0.750 mm | >= 120 sec @Thickness 0.0295 in | BK | ||
| High Amp Arc Ignition, HAI | >= 120 arcs @Thickness 0.750 mm | >= 120 arcs @Thickness 0.0295 in | BK | ||
| High Voltage Arc-Tracking Rate, HVTR | 0.000 - 10.0 mm/min @Thickness 3.00 mm | 0.000 - 0.394 in/min @Thickness 0.118 in | BK | ||
| Thermal Properties | Metric | English | Comments | ||
| Maximum Service Temperature, Air | 170 °C | 338 °F | <20000 hours; IEC 60216-P1 | ||
| 230 °C | 446 °F | < 50 hours; IEC 60216-P1 | |||
| Deflection Temperature at 8.0 MPa | 155 °C | 311 °F | ISO 75-2 | ||
| UL RTI, Electrical | 150 °C @Thickness 0.750 mm | 302 °F @Thickness 0.0295 in | BK | ||
| UL RTI, Mechanical with Impact | 150 °C @Thickness 0.750 mm | 302 °F @Thickness 0.0295 in | BK | ||
| UL RTI, Mechanical without Impact | 150 °C @Thickness 0.750 mm | 302 °F @Thickness 0.0295 in | BK | ||
| Flammability, UL94 | V-0 @Thickness 0.750 mm | V-0 @Thickness 0.0295 in | BK | ||
| Shrinkage | 0.18 % | 0.18 % | Compression molding, 168 hours/110°C; ISO 2577 | ||
| 0.25 % | 0.25 % | Injection molding, 168 hours/110°C; ISO 2577 | |||
| Processing Properties | Metric | English | Comments | ||
| Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding | ||
| Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding | ||
| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding | ||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding | ||
| 160 - 190 °C | 320 - 374 °F | Injection molding | |||
| Injection Pressure | >= 15.0 MPa | >= 2180 psi | Compression and injection cavity mold pressure | ||
| Back Pressure | 0.500 - 2.00 MPa | 72.5 - 290 psi | Injection molding | ||
| Cure Time | 0.167 - 0.333 min | 0.00278 - 0.00556 hour | Per 1 mm of wall thickness, injection molding | ||
| 0.333 - 0.667 min | 0.00556 - 0.0111 hour | Per 1 mm of wall thickness, compression molding | |||
| Descriptive Properties | |||||
| Chromatic Spectrum | All Colors | ||||
| Creep Rupture Strength | Very Good | ||||
| Holding Pressure | Approximately 40-60% of injection pressure | ||||
| Media Resistance | Very Good | ||||
| Moisture Absorption | 20 mg | ISO 62, 24 hours at 23°C | |||
| Reserves by Peak Temperature | Very High | ||||
| Thermal Expansion | Very Slight | ||||