- 密度 [g/cm3]: 1.4
- 彎曲模量 [MPa]: 7.50
| Physical Properties | Metric | English | Comments | ||
|---|---|---|---|---|---|
| Density | 1.40 g/cc | 0.0506 lb/in3 | ISO 1183 | ||
| Apparent Bulk Density | 0.550 g/cc | 0.0199 lb/in3 | ISO 60 | ||
| Linear Mold Shrinkage, Flow | 0.0040 cm/cm | 0.0040 in/in | Compression molding; ISO 2577 | ||
| Mechanical Properties | Metric | English | Comments | ||
| Ball Indentation Hardness | 250 MPa | 36300 psi | H 961/30; ISO 2039/P1 | ||
| Flexural Strength | 95.0 MPa | 13800 psi | 2 mm/min; ISO 178 | ||
| Flexural Modulus | 7.50 GPa | 1090 ksi | ISO 178 | ||
| Charpy Impact Unnotched | 0.800 J/cm2 @Temperature 23.0 °C | 3.81 ft-lb/in2 @Temperature 73.4 °F | ISO 179-1/2 eU | ||
| Charpy Impact, Notched | 0.550 J/cm2 @Temperature 23.0 °C | 2.62 ft-lb/in2 @Temperature 73.4 °F | ISO 179-1/2 eA | ||
| Electrical Properties | Metric | English | Comments | ||
| Volume Resistivity | 1.00e+11 ohm-cm | 1.00e+11 ohm-cm | IEC 60093 | ||
| Surface Resistance | 1.00e+10 ohm | 1.00e+10 ohm | IEC 60093 | ||
| Dielectric Constant | 15 @Frequency 100 Hz | 15 @Frequency 100 Hz | IEC 60250 | ||
| Dielectric Strength | 15.0 kV/mm @Thickness 1.00 mm | 381 kV/in @Thickness 0.0394 in | IEC 60243-P1 | ||
| Dissipation Factor | 0.30 @Frequency 100 Hz | 0.30 @Frequency 100 Hz | IEC 60250 | ||
| Comparative Tracking Index | 125 V | 125 V | Test liquid A; IEC 60112 | ||
| Thermal Properties | Metric | English | Comments | ||
| Maximum Service Temperature, Air | 130 °C | 266 °F | <20000 hours; IEC 60216-P1 | ||
| 160 °C | 320 °F | < 50 hours; IEC 60216-P1 | |||
| Deflection Temperature at 8.0 MPa | 115 °C | 239 °F | ISO 75-2 | ||
| Shrinkage | 0.50 % | 0.50 % | Compression molding, 168 hours/110°C; ISO 2577 | ||
| Processing Properties | Metric | English | Comments | ||
| Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding | ||
| Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding | ||
| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding | ||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding | ||
| 160 - 190 °C | 320 - 374 °F | Compression molding | |||
| Injection Pressure | >= 15.0 MPa | >= 2180 psi | Compression and injection cavity mold pressure | ||
| Back Pressure | 0.500 - 2.00 MPa | 72.5 - 290 psi | Injection molding | ||
| Cure Time | 0.167 - 0.333 min | 0.00278 - 0.00556 hour | Per 1 mm of wall thickness, injection molding | ||
| 0.333 - 0.667 min | 0.00556 - 0.0111 hour | Per 1 mm of wall thickness, compression molding | |||
| Descriptive Properties | |||||
| Chromatic Spectrum | Subdued Colors | ||||
| Creep Rupture Strength | Good | ||||
| Holding Pressure | Approximately 40-60% of injection pressure | ||||
| Media Resistance | Good | ||||
| Moisture Absorption | 90 mg | ISO 62, 24 hours at 23°C | |||
| Reserves by Peak Temperature | High | ||||
| Thermal Expansion | Slight | ||||