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Momentive Performance Materials PF 1107 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to Hig

Momentive Performance Materials PF 1107 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to Hig 物性表: Momentive Performance Materials PF 1107 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to Hig物性表及特性介紹,Momentive Performance Materials PF 1107 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to Hig注塑參數(shù)詳情,如需Momentive Performance Materials PF 1107 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to Hig下載, 可到相關(guān)下載區(qū)下載

密度 [g/cm3]: 2.0
彎曲模量 [MPa]: 17.0

Physical Properties	Metric	English	Comments

Density	2.00 g/cc	0.0723 lb/in3	ISO 1183
Apparent Bulk Density	0.970 g/cc	0.0350 lb/in3	ISO 60
Linear Mold Shrinkage, Flow	0.00 cm/cm	0.00 in/in	Compression molding; ISO 2577
	0.0016 cm/cm	0.0016 in/in	Injection molding; ISO 2577

Mechanical Properties	Metric	English	Comments
Ball Indentation Hardness	450 MPa	65300 psi	H 961/30; ISO 2039/P1
Flexural Strength	100 MPa	14500 psi	2 mm/min; ISO 178
Flexural Modulus	17.0 GPa	2470 ksi	ISO 178
Charpy Impact Unnotched	0.600 J/cm2 @Temperature 23.0 °C	2.86 ft-lb/in2 @Temperature 73.4 °F	ISO 179-1/2 eU
Charpy Impact, Notched	0.200 J/cm2 @Temperature 23.0 °C	0.952 ft-lb/in2 @Temperature 73.4 °F	ISO 179-1/2 eA

Electrical Properties	Metric	English	Comments
Volume Resistivity	1.00e+12 ohm-cm	1.00e+12 ohm-cm	IEC 60093
Surface Resistance	1.00e+11 ohm	1.00e+11 ohm	IEC 60093
Dielectric Constant	6.0 @Frequency 100 Hz	6.0 @Frequency 100 Hz	IEC 60250
Dielectric Strength	30.0 kV/mm @Thickness 1.00 mm	762 kV/in @Thickness 0.0394 in	IEC 60243-P1
Dissipation Factor	0.050 @Frequency 100 Hz	0.050 @Frequency 100 Hz	IEC 60250

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	160 °C	320 °F	<20000 hours; IEC 60216-P1
	280 °C	536 °F	< 50 hours; IEC 60216-P1
Deflection Temperature at 8.0 MPa	170 °C	338 °F	ISO 75-2
Shrinkage	0.030 %	0.030 %	Compression molding, 168 hours/110°C; ISO 2577
	0.080 %	0.080 %	Injection molding, 168 hours/110°C; ISO 2577

Processing Properties	Metric	English	Comments
Feed Temperature	60.0 - 75.0 °C	140 - 167 °F	Injection molding
Nozzle Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Melt Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Mold Temperature	160 - 190 °C	320 - 374 °F	Injection molding
	160 - 190 °C	320 - 374 °F	Compression molding
Injection Pressure	>= 15.0 MPa	>= 2180 psi	Compression and injection cavity mold pressure
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding

Descriptive Properties
Chromatic Spectrum	All Colors
Creep Rupture Strength	Very Good
Holding Pressure	Approximately 40-60% of injection pressure
Media Resistance	Very Good
Moisture Absorption	5 mg		ISO 62, 24 hours at 23°C
Reserves by Peak Temperature	Very High
Thermal Expansion	Very Slight

關(guān)鍵詞:
供應(yīng)
Low Shrinkage
酚醛樹(shù)脂
Momentive Performance Materials PF 1107 Phenolic Formaldehyde Resin
Resistant to Hig

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