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Momentive Performance Materials PF 6501 Phenolic Formaldehyde Resin, Low Shrinkage

Momentive Performance Materials PF 6501 Phenolic Formaldehyde Resin, Low Shrinkage 物性表: Momentive Performance Materials PF 6501 Phenolic Formaldehyde Resin, Low Shrinkage物性表及特性介紹,Momentive Performance Materials PF 6501 Phenolic Formaldehyde Resin, Low Shrinkage注塑參數(shù)詳情,如需Momentive Performance Materials PF 6501 Phenolic Formaldehyde Resin, Low Shrinkage下載, 可到相關(guān)下載區(qū)下載

密度 [g/cm3]: 1.6
彎曲模量 [MPa]: 12.5

Physical Properties	Metric	English	Comments

Density	1.60 g/cc	0.0578 lb/in3	ISO 1183
Apparent Bulk Density	0.640 g/cc	0.0231 lb/in3	ISO 60
Linear Mold Shrinkage, Flow	0.0017 cm/cm	0.0017 in/in	Compression molding; ISO 2577
	0.0018 cm/cm	0.0018 in/in	Injection molding; ISO 2577

Mechanical Properties	Metric	English	Comments
Ball Indentation Hardness	400 MPa	58000 psi	H 961/30; ISO 2039/P1
Flexural Strength	175 MPa	25400 psi	2 mm/min; ISO 178
Flexural Modulus	12.5 GPa	1810 ksi	ISO 178
Charpy Impact Unnotched	1.20 J/cm2 @Temperature 23.0 °C	5.71 ft-lb/in2 @Temperature 73.4 °F	ISO 179-1/2 eU
Charpy Impact, Notched	0.350 J/cm2 @Temperature 23.0 °C	1.67 ft-lb/in2 @Temperature 73.4 °F	ISO 179-1/2 eA

Electrical Properties	Metric	English	Comments
Volume Resistivity	1.00e+11 ohm-cm	1.00e+11 ohm-cm	IEC 60093
Surface Resistance	1.00e+10 ohm	1.00e+10 ohm	IEC 60093
Dielectric Constant	6.5 @Frequency 100 Hz	6.5 @Frequency 100 Hz	IEC 60250
Dielectric Strength	30.0 kV/mm @Thickness 1.00 mm	762 kV/in @Thickness 0.0394 in	IEC 60243-P1
Dissipation Factor	0.10 @Frequency 100 Hz	0.10 @Frequency 100 Hz	IEC 60250

Thermal Properties	Metric	English	Comments
Deflection Temperature at 8.0 MPa	170 °C	338 °F	ISO 75-2
Shrinkage	0.070 %	0.070 %	Compression molding, 168 hours/110°C; ISO 2577
	0.080 %	0.080 %	Injection molding, 168 hours/110°C; ISO 2577

Processing Properties	Metric	English	Comments
Feed Temperature	60.0 - 75.0 °C	140 - 167 °F	Injection molding
Nozzle Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Melt Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Mold Temperature	160 - 190 °C	320 - 374 °F	Injection molding
	160 - 190 °C	320 - 374 °F	Compression molding
Injection Pressure	>= 15.0 MPa	>= 2180 psi	Compression and injection cavity mold pressure
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding

Descriptive Properties
Chromatic Spectrum	All Colors
Creep Rupture Strength	Very Good
Holding Pressure	Approximately 40-60% of injection pressure
Media Resistance	Very Good
Moisture Absorption	11 mg		ISO 62, 24 hours at 23°C
Reserves by Peak Temperature	Very High
Thermal Expansion	Very Slight

關(guān)鍵詞:
供應(yīng)
Low Shrinkage
酚醛樹脂
Momentive Performance Materials PF 6501 Phenolic Formaldehyde Resin

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