- 密度 [g/cm3]: 2.1
| Physical Properties | Metric | English | Comments | ||
|---|---|---|---|---|---|
| Density | 2.10 g/cc | 0.0759 lb/in3 | |||
| Water Absorption | <= 0.10 % | <= 0.10 % | D24/23; IPC-TM-650 2.6.2.1 | ||
| Thickness | 127 - 1520 microns | 5.00 - 60.0 mil | Range of Thicknesses Available | ||
| Mechanical Properties | Metric | English | Comments | ||
| Peel Strength | 1.79 kN/m @Temperature 288 °C, Time 10.0 sec | 10.2 pli @Temperature 550 °F, Time 0.00278 hour | Copper, After Solder Float; IPC-TM-650 2.4.8 | ||
| Electrical Properties | Metric | English | Comments | ||
| Volume Resistivity | 1.00e+13 ohm-cm | 1.00e+13 ohm-cm | Cond. A; IPC 2.5.17.1 | ||
| Surface Resistance | 1.00e+13 ohm | 1.00e+13 ohm | Cond. A; IPC 2.5.17.1 | ||
| Dielectric Constant | 3.45 - 3.55 @Frequency 1.00e+10 Hz | 3.45 - 3.55 @Frequency 1.00e+10 Hz | Process, Clamped Stripline; IPC-TM-650 2.5.5.5 | ||
| 3.6 @Frequency 8.00e+9 - 4.00e+10 Hz | 3.6 @Frequency 8.00e+9 - 4.00e+10 Hz | Design; Differential Phase Length Method | |||
| Dissipation Factor | 0.0017 @Frequency 1.00e+10 Hz | 0.0017 @Frequency 1.00e+10 Hz | IPC-TM-650 2.5.5.5 | ||
| Thermal Properties | Metric | English | Comments | ||
| CTE, linear | 17.0 μm/m-°C @Temperature -55.0 - 288 °C | 9.44 μin/in-°F @Temperature -67.0 - 550 °F | X, Y- Direction; IPC-TM-650 2.4.41 | ||
| 24.0 μm/m-°C @Temperature -55.0 - 288 °C | 13.3 μin/in-°F @Temperature -67.0 - 550 °F | Z-Direction; IPC-TM-650 2.4.41 | |||
| Specific Heat Capacity | 0.930 J/g-°C | 0.222 BTU/lb-°F | Calculated | ||
| Thermal Conductivity | 0.500 W/m-K @Temperature 80.0 °C | 3.47 BTU-in/hr-ft2-°F @Temperature 176 °F | ASTM C518 | ||
| Flammability, UL94 | V-0 | V-0 | |||
| Descriptive Properties | |||||
| Thermal Coefficient of Dielectric Constant | -11 ppm/°C | IPC-TM-650 2.5.5.5; 10°C to 150°C; Z-Direction | |||
| -34 ppm/°C | IPC-TM-650 2.5.5.5; -50°C to 10°C; Z-Direction | ||||