- 密度 [g/cm3]: 1.86
- 缺口沖擊強度: 4.0
- 彎曲模量 [MPa]: 19.0
| Physical Properties | Metric | English | Comments | ||
|---|---|---|---|---|---|
| Bulk Density | 0.700 g/cc | 0.0253 lb/in3 | Powder Density; ISO 60 | ||
| Density | 1.86 g/cc | 0.0672 lb/in3 | Relative Density; ISO 1183 | ||
| Linear Mold Shrinkage | 0.0010 cm/cm | 0.0010 in/in | Compression Molding; ISO 2577 | ||
| Mechanical Properties | Metric | English | Comments | ||
| Hardness, Rockwell E | 90 | 90 | ISO 2039/2 | ||
| Tensile Strength at Break | 70.0 MPa | 10200 psi | ISO 527 | ||
| Flexural Strength | 130 MPa | 18900 psi | At Rupture; ISO 178 | ||
| Flexural Modulus | 19.0 GPa | 2760 ksi | ISO 178 | ||
| Compressive Strength | 215 MPa | 31200 psi | ISO 604 | ||
| Izod Impact, Notched (ISO) | 4.00 kJ/m2 | 1.90 ft-lb/in2 | ISO 180 | ||
| Electrical Properties | Metric | English | Comments | ||
| Dielectric Strength | 12.5 kV/mm | 318 kV/in | 60Hz, Short Time, dry; ASTM D149 | ||
| Arc Resistance | 180 sec | 180 sec | ASTM D495 | ||
| Thermal Properties | Metric | English | Comments | ||
| CTE, linear, Parallel to Flow | 23.0 μm/m-°C @Temperature 20.0 °C | 12.8 μin/in-°F @Temperature 68.0 °F | ASTM E-831 | ||
| CTE, linear, Transverse to Flow | 42.0 μm/m-°C @Temperature 20.0 °C | 23.3 μin/in-°F @Temperature 68.0 °F | ASTM E-831 | ||
| Thermal Conductivity | 0.680 W/m-K | 4.72 BTU-in/hr-ft2-°F | ASTM C-518 | ||
| Deflection Temperature at 1.8 MPa (264 psi) | 225 °C | 437 °F | As molded; ISO 75 A | ||
| >= 282 °C | >= 540 °F | Post Baked; ISO 75 A | |||
| Descriptive Properties | |||||
| Color | Black | ||||
| Form | Flake | ||||
| Main Filler | Glass Fiber | ||||
| Molding Method | Compression, transfer, injection | ||||