- 密度 [g/cm3]: 2.1
- 彎曲模量 [MPa]: 27.0
| Physical Properties | Metric | English | Comments | ||
|---|---|---|---|---|---|
| Bulk Density | 0.950 g/cc | 0.0343 lb/in3 | Powder Density; ISO 60 | ||
| Density | 2.10 g/cc | 0.0759 lb/in3 | Relative Density; ISO 1183 | ||
| Linear Mold Shrinkage | 0.00060 cm/cm | 0.00060 in/in | Compression Molding; ISO 2577 | ||
| Mechanical Properties | Metric | English | Comments | ||
| Hardness, Rockwell E | 105 | 105 | ISO 2039/2 | ||
| Tensile Strength at Break | 100 MPa | 14500 psi | ISO 527 | ||
| Flexural Strength | 165 MPa | 23900 psi | At Rupture; ISO 178 | ||
| Flexural Modulus | 27.0 GPa | 3920 ksi | ISO 178 | ||
| Compressive Strength | 410 MPa | 59500 psi | ISO 604 | ||
| Charpy Impact, Notched | 0.200 J/cm2 | 0.952 ft-lb/in2 | ISO 179 | ||
| Electrical Properties | Metric | English | Comments | ||
| Dielectric Strength | 14.0 kV/mm @Thickness 3.00 mm | 356 kV/in @Thickness 0.118 in | ASTM D149 | ||
| Arc Resistance | 180 sec | 180 sec | ASTM D495 | ||
| Comparative Tracking Index | 250 V | 250 V | IEC 112 | ||
| Thermal Properties | Metric | English | Comments | ||
| CTE, linear, Parallel to Flow | 17.0 μm/m-°C @Temperature 20.0 °C | 9.44 μin/in-°F @Temperature 68.0 °F | TMA | ||
| Thermal Conductivity | 0.940 W/m-K | 6.52 BTU-in/hr-ft2-°F | ASTM C-518 | ||
| Deflection Temperature at 1.8 MPa (264 psi) | 200 °C | 392 °F | As molded; ISO 75 A | ||
| >= 282 °C | >= 540 °F | Post Baked; ISO 75 A | |||
| Descriptive Properties | |||||
| Color | Black | ||||
| Form | Granular | ||||
| Main Filler | Glass Fiber & Mineral | ||||
| Molding Method | Compression, transfer, injection | ||||