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Product TextsChemical abbreviation according to ISO 1043-1: POM24705 mm as16	kg	ISO 1133
成型收縮(Molding shrinkage) (parallel)	2.0	%	ISO 294-4, 2577
成型收縮(Molding shrinkage) (normal)	1.8	%	ISO 294-4, 2577

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機(jī)械性能(機(jī)械性能(Mechanical properties))

值(Value)

單位(Unit)

測試標(biāo)準(zhǔn)(Test Standard)

ISO數(shù)據(jù)(ISO數(shù)據(jù)(CAMPUS/ISO) Data)

拉伸模量(Tensile Modulus)

2850

MPa

ISO 527-1/-2

屈服應(yīng)力(Yield stress)

MPa

ISO 527-1/-2

屈服應(yīng)變(Yield strain)

ISO 527-1/-2

斷裂拉伸應(yīng)變(Nominal strain at break)

ISO 527-1/-2

Tensile creep modulus (1h)

2500

MPa

ISO 899-1

Tensile creep modulus (1000h)

1300

MPa

ISO 899-1

簡支梁沖擊強(qiáng)度(Charpy impact strength) (+23°C)

180[P]

kJ/m2

ISO 179/1eU

簡支梁沖擊強(qiáng)度(Charpy impact strength) (-30°C)

160

kJ/m2

ISO 179/1eU

簡支梁缺口沖擊強(qiáng)度(Charpy notched impact strength) (+23°C)

6.5

kJ/m2

ISO 179/1eA

簡支梁缺口沖擊強(qiáng)度(Charpy notched impact strength) (-30°C)

kJ/m2

ISO 179/1eA

Partial Break

熱性能(熱性能(Thermal properties))	值(Value)	單位(Unit)	測試標(biāo)準(zhǔn)(Test Standard)
ISO數(shù)據(jù)(ISO數(shù)據(jù)(CAMPUS/ISO) Data)
熔化溫度(熔化溫度(Melting temperature)) (10°C/min)	166	°C	ISO 11357-1/-3
溫度負(fù)荷變形(Temp. of deflection under load) (1.80 MPa)	104	°C	ISO 75-1/-2
維卡軟化溫度（50℃/ h的50N）Vicat softening temperature	150	°C	ISO 306
COEFF線性熱(Coeff. of linear therm. expansion) (parallel)	110	E-6/K	ISO 11359-1/-2
COEFF線性熱(Coeff. of linear therm. expansion) (normal)	110	E-6/K	ISO 11359-1/-2
燃燒性(球壓痕硬度(Burning behav)). at 1.5 mm nom. thickn.	HB	class	IEC 60695-11-10
厚度測試(Thickness tested)	1.5	mm	IEC 60695-11-10
UL 識(shí)別(recognition)	UL	-	-
燃燒性(球壓痕硬度(Burning behav)). at thickness h	HB	class	IEC 60695-11-10
厚度測試(Thickness tested)	3.0	mm	IEC 60695-11-10
UL 識(shí)別(recognition)	UL	-	-

電氣性能(Electrical properties)	值(Value)	單位(Unit)	測試標(biāo)準(zhǔn)(Test Standard)
ISO數(shù)據(jù)(ISO數(shù)據(jù)(CAMPUS/ISO) Data)
相對(duì)介電常數(shù)(Relative permittivity) (100Hz)	4	-	IEC 60250
相對(duì)介電常數(shù)(Relative permittivity) (1MHz)	4	-	IEC 60250
耗散因數(shù)(耗散因數(shù)(Dissipation factor)) (100Hz)	20	E-4	IEC 60250
耗散因數(shù)(耗散因數(shù)(Dissipation factor)) (1MHz)	50	E-4	IEC 60250
體積電阻率(Volume resistivity)	1E12	Ohm*m	IEC 60093
表面電阻率(Surface resistivity)	1E14	Ohm	IEC 60093
電氣強(qiáng)度(Electric strength)	35	kV/mm	IEC 60243-1
相比漏電起痕指數(shù)(Comparative tracking index)	600	-	IEC 60112

其他屬性(Other properties)	值(Value)	單位(Unit)	測試標(biāo)準(zhǔn)(Test Standard)
ISO數(shù)據(jù)(ISO數(shù)據(jù)(CAMPUS/ISO) Data)
吸水率(Water absorption)	0.65	%	Sim. to ISO 62
吸濕性(Humidity absorption)	0.2	%	Sim. to ISO 62
密度(Density)	1410	kg/m3	ISO 1183

流變計(jì)算屬性(Rheological calculation properties)	值(Value)	單位(Unit)	測試標(biāo)準(zhǔn)(Test Standard)
ISO數(shù)據(jù)(ISO數(shù)據(jù)(CAMPUS/ISO) Data)
密度(Density) of melt	1200	kg/m3	-
熔體熱導(dǎo)率(Thermal conductivity of melt)	0.155	W/(m K)	-
規(guī)格的熱容融化(Spec. heat capacity of melt)	2210	J/(kg K)	-
Eff. thermal diffusivity	4.85E-8	m2/s	-
噴射溫度(Ejection temperature)	165	°C	-

Test specimen production	值(Value)	單位(Unit)	測試標(biāo)準(zhǔn)(Test Standard)
ISO數(shù)據(jù)(ISO數(shù)據(jù)(CAMPUS/ISO) Data)
Processing conditions acc. ISO	9990	-	ISO ....-2
Injection Molding, melt temperature	205	°C	ISO 294
Injection Molding, mold temperature	90	°C	ISO 10724
Injection Molding, injection velocity	200	mm/s	ISO 294
Injection Molding, pressure at hold	90	MPa	ISO 294

Diagrams 40 mm Water content 0,2%g. moisturizing is not necessary.Film extrusionPREPROCESSING 40 mm Water content 0,2%g. moisturizing is not necessary. 40 mm Water content 0,2%g. moisturizing is not necessary. 40 mm Water content 0,2%g. moisturizing is not necessary. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from M-Base; this is especially valid for claims of compensation resulting from consequential damages. M-Base explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
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