- 密度 [g/cm3]: 1.19
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 1.19 - 1.29 g/cc | 0.0430 - 0.0466 lb/in3 | B Component; ASTM D1475 |
| 2.02 - 2.12 g/cc | 0.0730 - 0.0766 lb/in3 | A Component; ASTM D1475 | |
| Viscosity | 45 cP | 45 cP | B Component; ASTM D1824 |
| 115000 cP | 115000 cP | A Component; ASTM D1824 | |
| Outgassing - Total Mass Loss | 0.15 % | 0.15 % | Cured property; at 10E-6 torr; ASTM E595 |
| Collected Volatile Condensable Material | 0.0040 % | 0.0040 % | Cured property; at 10E-6 torr; ASTM E595 |
| Mechanical Properties | Metric | English | Comments |
| Hardness, Shore A | 83 | 83 | Cured property @ 1/2 inch casting; ASTM D2240 |
| Adhesive Bond Strength | 2.93 MPa | 425 psi | Al-to-Al Lap Shear; Cured property; ASTM D1002 |
| Electrical Properties | Metric | English | Comments |
| Volume Resistivity | 7.00e+14 ohm-cm | 7.00e+14 ohm-cm | Cured property; ASTM D257 |
| Dielectric Constant | 5.8 @Frequency 1000 Hz | 5.8 @Frequency 1000 Hz | Cured property; ASTM D150 |
| Dielectric Strength | 13.4 kV/mm @Thickness 3.17 mm | 340 kV/in @Thickness 0.125 in | Cured; ASTM D149 |
| Dissipation Factor | 0.030 @Frequency 1000 Hz | 0.030 @Frequency 1000 Hz | Cured property; ASTM D150 |
| Thermal Properties | Metric | English | Comments |
| CTE, linear | 31.0 μm/m-°C @Temperature 20.0 °C | 17.2 μin/in-°F @Temperature 68.0 °F | Cured property; alpha 1 |
| 147 μm/m-°C @Temperature 20.0 °C | 81.7 μin/in-°F @Temperature 68.0 °F | Cured property; alpha 2 | |
| Thermal Conductivity | 0.744 W/m-K | 5.16 BTU-in/hr-ft2-°F | Cured Property; E1225 |
| Glass Transition Temp, Tg | -60.0 °C | -76.0 °F | Cured property; JMTP P-200 |
| Flash Point | >= 150 °C | >= 302 °F | B Component; ASTM D92 |
| >= 200 °C | >= 392 °F | A Component; ASTM D92 | |
| Processing Properties | Metric | English | Comments |
| Processing Temperature | 80.0 °C | 176 °F | Cure 8 hrs |
| 100 °C | 212 °F | Cure 4 hrs | |