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Momentive Performance Materials MP 4165 Melamine Phenolic Resin, Copper Adhesive, Low Shrinkage, Hig

Momentive Performance Materials MP 4165 Melamine Phenolic Resin, Copper Adhesive, Low Shrinkage, Hig 物性表: Momentive Performance Materials MP 4165 Melamine Phenolic Resin, Copper Adhesive, Low Shrinkage, Hig物性表及特性介紹,Momentive Performance Materials MP 4165 Melamine Phenolic Resin, Copper Adhesive, Low Shrinkage, Hig注塑參數(shù)詳情,如需Momentive Performance Materials MP 4165 Melamine Phenolic Resin, Copper Adhesive, Low Shrinkage, Hig下載, 可到相關(guān)下載區(qū)下載

密度 [g/cm3]: 1.81
彎曲模量 [MPa]: 12.5

Physical Properties	Metric	English	Comments

Density	1.81 g/cc	0.0654 lb/in3	ISO 1183
Apparent Bulk Density	0.700 g/cc	0.0253 lb/in3	ISO 60
Linear Mold Shrinkage, Flow	-0.000500 cm/cm	-0.000500 in/in	Compression molding; ISO 2577
	0.00040 cm/cm	0.00040 in/in	Injection molding; ISO 2577

Mechanical Properties	Metric	English	Comments
Ball Indentation Hardness	300 MPa	43500 psi	H 961/30; ISO 2039/P1
Tensile Strength at Break	60.0 MPa	8700 psi	5 mm/min; ISO 527 - 1/2
Tensile Modulus	12.5 GPa	1810 ksi	1 mm/min; ISO 527 - 1/2
Flexural Strength	105 MPa	15200 psi	2 mm/min; ISO 178
Flexural Modulus	12.5 GPa	1810 ksi	ISO 178
Compressive Strength	160 MPa	23200 psi	Test specimen flat tested; ISO 604
Charpy Impact Unnotched	0.700 J/cm2 @Temperature 23.0 °C	3.33 ft-lb/in2 @Temperature 73.4 °F	ISO 179-1/2 eU
Charpy Impact, Notched	0.200 J/cm2 @Temperature 23.0 °C	0.952 ft-lb/in2 @Temperature 73.4 °F	ISO 179-1/2 eA

Electrical Properties	Metric	English	Comments
Volume Resistivity	1.00e+12 ohm-cm	1.00e+12 ohm-cm	IEC 60093
Surface Resistance	1.00e+11 ohm	1.00e+11 ohm	IEC 60093
Dielectric Constant	7.0 @Frequency 100 Hz	7.0 @Frequency 100 Hz	IEC 60250
Dielectric Strength	30.0 kV/mm @Thickness 1.00 mm	762 kV/in @Thickness 0.0394 in	IEC 60243-P1
Dissipation Factor	0.080 @Frequency 100 Hz	0.080 @Frequency 100 Hz	IEC 60250
Comparative Tracking Index	300 V	300 V	Test liquid A; IEC 60112

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	150 °C	302 °F	<20000 hours; IEC 60216-P1
	190 °C	374 °F	< 50 hours; IEC 60216-P1
Deflection Temperature at 8.0 MPa	135 °C	275 °F	ISO 75-2
Shrinkage	0.25 %	0.25 %	Compression molding, 168 hours/110°C; ISO 2577
	0.29 %	0.29 %	Injection molding, 168 hours/110°C; ISO 2577

Processing Properties	Metric	English	Comments
Feed Temperature	60.0 - 75.0 °C	140 - 167 °F	Injection molding
Nozzle Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Melt Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Mold Temperature	160 - 170 °C	320 - 338 °F	Compression molding
	160 - 170 °C	320 - 338 °F	Injection molding
Injection Pressure	>= 15.0 MPa	>= 2180 psi	Compression and injection cavity mold pressure
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
	0.333 - 0.667 min	0.00556 - 0.0111 hour	Per 1 mm of wall thickness, compression molding

Descriptive Properties
Holding Pressure	Approximately 40-60% of injection pressure
Moisture Absorption	13 mg		ISO 62, 24 hours at 23°C

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Momentive Performance Materials MP 4165 Melamine Phenolic Resin
Copper Adhesive
Low Shrinkage
Hig

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